BUSINESS MOBILE CAMERA SOLUTION

We are maintaining our unrivaled competitive edge with our invisible core imaging solution
technology for next-generation IT devices that will create the smart lifestyle of the future.

SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA

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CAMERA MODULE FOR MOBILE

SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA



Stable mass production yield for various
camera modules (5M FF – 108M AF)

WIDE ANGLE VT CAMERA 90°,120°,135°,145°,182°8M FF ~ 32M FF

MACRO CAMERA 5M FF SINGLE CAM 13~64M AFDUAL CAMERA


Smaller sensor pixel size(3.3→2.8→2.2→0.9→0.8㎛)


SMART PHONE CAMERA MODULE

SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA

FIXED FOCUS MODEL

5M FF
5M FF
5M FF
5M FF
F.NO_2.0 / FOV_68° F.NO_2.0 / FOV_68°
F.NO_2.4 / FOV_78° F.NO_2.4 / FOV_78°
F.NO_2.4 / FOV_85° F.NO_2.4 / FOV_85°
F.NO_2.2 / FOV_123° F.NO_2.2 / FOV_123°
8M FF
12M FF
12M FF
13M FF
F.NO_2.2 / FOV_80° F.NO_2.2 / FOV_80°
F.NO_2.2 / FOV_120° F.NO_2.2 / FOV_120°
F.NO_2.2 / FOV_123° F.NO_2.2 / FOV_123°
F.NO_2.0 / FOV_78° F.NO_2.0 / FOV_78°
16M FF
16M FF
24M FF
F.NO_1.9 / FOV_76° F.NO_1.9 / FOV_76°
F.NO_2.0 / FOV_79° F.NO_2.0 / FOV_79°
F.NO_1.9 / FOV_76° F.NO_1.9 / FOV_76°

AUTO FOCUS MODEL

10M AF
10M AF
10M AF
13M AF
F.NO_2.2 / FOV_85°° F.NO_2.2 / FOV_85°
F.NO_2.2 / FOV_80°° F.NO_2.2 / FOV_80°
F.NO_2.4 / FOV_80° F.NO_2.4 / FOV_80°
F.NO_1.7 / FOV_75° F.NO_1.7 / FOV_75°
13M AF
13M AF
40M AF
48M AF
F.NO_2.0 / FOV_76° F.NO_2.0 / FOV_76°
F.NO_1.9 / FOV_77° F.NO_1.9 / FOV_77°
F.NO_2.2 / FOV_80° F.NO_2.2 / FOV_80°
F.NO_1.8 / FOV_80° F.NO_1.8 / FOV_80°
48M AF
64M AF
.
F.NO_2.0 / FOV_80° F.NO_2.0 / FOV_80°
F.NO_1.8 / FOV_81° F.NO_1.8 / FOV_81°
.

OIS MODEL

8M OIS
10M OIS
12M OIS
12M OIS
F.NO_2.4 / FOV_32° F.NO_2.4 / FOV_32°
F.NO_2.2 / FOV_80°° F.NO_2.4 / FOV35°
F.NO_2.4 / FOV_80° F.NO_2.4 / FOV_76°
F.NO_1.7 / FOV_75° F.NO_2.4 / FOV_36°
48M OIS
640M OIS
108M OIS
F.NO_2.0 / FOV_76° F.NO_1.8 / FOV_80°
F.NO_1.9 / FOV_77° F.NO_1.8 / FOV_81°
F.NO_2.2 / FOV_80° F.NO_1.8 / FOV_85°

MULTI MODEL

65M AF+12M AF
12M AF+12M AF
64M+12M FF+5M FF
48M AF+12M F+5M FF
F.NO_2.4 / FOV_32° 65M:F.NO_2.0 / FOV_76°
12M:F.NO_1.8 / FOV_79°
.
F.NO_2.2 / FOV_80°° 12M(L):F.NO_2.2 / FOV_80°
12M(R):F.NO_2.4 / FOV_120°
.
F.NO_2.4 / FOV_80° 65M:F.NO_1.8 / FOV_81°
12M:F.NO_2.2 / FOV_123°
5M:F.NO_2.2 / FOV_84°
F.NO_1.7 / FOV_75° 48M:F.NO_2.0 / FOV_80°
12M:F.NO_2.2 / FOV_123°
5M:F.NO_2.4 / FOV_78°
24M AF+10M FF+8M FF+5M FF
F.NO_2.0 / FOV_76° 24M:F.NO_1.7 / FOV_77°  10M:F.NO_2.4 / FOV_45°
8M:F.NO_2.4 / FOV_120°  5M:F.NO_2.4 / FOV_85°
AF SPEC
ITEMS UNIT SPEC
Rated Stroke um Min 2410
Hysteresis um Max 12
Linearity um Max 20
Holding Current mA Max 40
Actuating Tilt Min Max 10
OIS SPEC
ITEMS UNIT SPEC
Rated Stroke Deg Min 2.4 (±1.2)
Hysteresis Deg Max 0.10
Linearity Deg Max 0.11
Max current mA Max 100
Phase margin Deg Max 25
Loop Gain dB Min 20
SPECIFICATION
ITEMS MIN NORMAL MAX UNIT REMARK
PKG Height 222 270 318 UM
Ball Pitch X - 500 - UM
Ball Pitch Y - 500 - UM
Total Ball Count - 314 - EA
Resolution - 320 X 240 - PX QVGA
Modulation frequency of VCSEL Driver 20 - 100 MHZ
VCSEL wavelength - 940 - NM
KEY FEATURES
Size Removal of PCB, substrate-less
3D stacking of TOF sensor and the driver IC
Thickness reduction (>230um) / Area reduction (>20%)
Easy mounting No Ceramic Carrier or substrate PCB needed
UseACF film or SMT process to electrically assemble the FOWLP onto the F-PCB
Mass-production The optical FOWLP is fabricated by the wafer level process with mass-production capability
OUTSIDE VIEW AND FEATURE
카메라 모듈
Exterior Darwing and Characteristics
Using MODULE TITL form, no more resolution deterioration problem as in pre-existing LENS SHIFT/TITL form
Compared to pre-existion commercialized methods, correction angle doubled (1.5DEG → ±3DEG)
Existing commercialized product : Supports hand shaking correction
MODULE TILT OIS : Supports hand shaking correction + external shaking(shooting while moving on uneven topography, etc.) correction
SPECIFICATION
ITEMS CONDITION
Foot Print A : 18.4 x 18.4 x 1.8H / B : 14.0 x 14.0 x 4.7H
Stabilizing Angle ± 3deg
Max Current AF : 50mA / OIS : 100mA (TBD)
Pixels 48M
SENSOR SONY 1/2" 48Mega CMOS IMS586-AAJH5-S
Sensor Size 4.504mm(H) x 5.659mm(V)
LENS SUNNY 39256
LENS Spec 8.25/6P
AF STROKE 380 ~ 430um
RC MODEL CAR
카메라 모듈
TILT. OIS OFF
카메라 모듈
TILT. OIS ON
카메라 모듈

TILT OIS. VIDEO

5MP USB CAMERA BOARD

ITEM USB Camera SPEC
Form factor PCB Module Type
PCB SIZE 50mm x 7mm x 0.8T
Camera Resolution(MAX) 5MP(2592x1944)
Image Sensor 1/5, Pixel size:1.12um
Video Max frame rate 30fps@5Mp(2592 x 1944)/30fps@quad HD(2560 x 1440)
MIC 2MIC Support
I/O Interface USB 2.0
Camera Interface(AP-Camera) MIPI(CSI-2/4 lane)
Lens spec 4P, F2.4
8MP USB CAMERA BOARD

ITEM USB Camera SPEC
Form factor PCB Module Type
PCB SIZE 40mm x 12mm x 1.0T
Camera Resolution(MAX) 8MP(3264x2448)
Image Sensor 1/4, 200um, Pixel size:1.12um
Video Max frame rate MJPEG: 8MP 10fps@(3264 x 2448), 4:3
5MP 10fps @(2592 x 1944)
2MP 60fps @(1600 x 1200) / YUY2:5fps@(1600x1200)
MIC Option
I/O Interface USB 2.0
Camera Interface(AP-Camera) MIPI(CSI-2/4 lane)
Lens spec 4P, F2.2
  • 3D DEPTH CAMERA
  • 3D DEPTH CAMERA
    2 cameras can be driven with 1 controller; image compositing through controller possible, 3D materialization possible without separate software, so user can choose 2D or 3D
    SIDE BY SIDE (SHUTTER GLASS) Screen
    Displayed with left/right crossing for every frame, left/right liquid crystal shutters open/close in a crossing manner matching with the frame timing

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is always closed to our life every time and everywhere.

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