Together with our employees and partners with one heart and a common will, we vow to devote ourselves to increasing company and shareholder value.
We are maintaining our unrivaled competitive edge with our invisible core imaging solution
technology for next-generation IT devices that will create the smart lifestyle of the future.
SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA
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SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA
WIDE ANGLE VT CAMERA 90°,120°,135°,145°,182°8M FF ~ 32M FF
MACRO CAMERA 5M FF SINGLE CAM 13~64M AFDUAL CAMERA
SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA
ITEMS | UNIT | SPEC |
---|---|---|
Rated Stroke | um | Min 2410 |
Hysteresis | um | Max 12 |
Linearity | um | Max 20 |
Holding Current | mA | Max 40 |
Actuating Tilt | Min | Max 10 |
ITEMS | UNIT | SPEC |
---|---|---|
Rated Stroke | Deg | Min 2.4 (±1.2) |
Hysteresis | Deg | Max 0.10 |
Linearity | Deg | Max 0.11 |
Max current | mA | Max 100 |
Phase margin | Deg | Max 25 |
Loop Gain | dB | Min 20 |
ITEMS | MIN | NORMAL | MAX | UNIT | REMARK |
---|---|---|---|---|---|
PKG Height | 222 | 270 | 318 | UM | |
Ball Pitch X | - | 500 | - | UM | |
Ball Pitch Y | - | 500 | - | UM | |
Total Ball Count | - | 314 | - | EA | |
Resolution | - | 320 X 240 | - | PX | QVGA |
Modulation frequency of VCSEL Driver | 20 | - | 100 | MHZ | |
VCSEL wavelength | - | 940 | - | NM |
Size | Removal of PCB, substrate-less | |
3D stacking of TOF sensor and the driver IC | ||
Thickness reduction (>230um) / Area reduction (>20%) | ||
Easy mounting | No Ceramic Carrier or substrate PCB needed | |
UseACF film or SMT process to electrically assemble the FOWLP onto the F-PCB | ||
Mass-production | The optical FOWLP is fabricated by the wafer level process with mass-production capability |
Exterior Darwing and Characteristics |
Using MODULE TITL form, no more resolution deterioration problem as in pre-existing LENS SHIFT/TITL form |
Compared to pre-existion commercialized methods, correction angle doubled (1.5DEG → ±3DEG) |
Existing commercialized product : Supports hand shaking correction | MODULE TILT OIS : Supports hand shaking correction + external shaking(shooting while moving on uneven topography, etc.) correction |
ITEMS | CONDITION |
---|---|
Foot Print | A : 18.4 x 18.4 x 1.8H / B : 14.0 x 14.0 x 4.7H |
Stabilizing Angle | ± 3deg |
Max Current | AF : 50mA / OIS : 100mA (TBD) |
Pixels | 48M |
SENSOR | SONY 1/2" 48Mega CMOS IMS586-AAJH5-S |
Sensor Size | 4.504mm(H) x 5.659mm(V) |
LENS | SUNNY 39256 |
LENS Spec | 8.25/6P |
AF STROKE | 380 ~ 430um |
ITEM | USB Camera SPEC |
---|---|
Form factor | PCB Module Type |
PCB SIZE | 50mm x 7mm x 0.8T |
Camera Resolution(MAX) | 5MP(2592x1944) |
Image Sensor | 1/5, Pixel size:1.12um |
Video Max frame rate | 30fps@5Mp(2592 x 1944)/30fps@quad HD(2560 x 1440) |
MIC | 2MIC Support |
I/O Interface | USB 2.0 |
Camera Interface(AP-Camera) | MIPI(CSI-2/4 lane) |
Lens spec | 4P, F2.4 |
ITEM | USB Camera SPEC |
---|---|
Form factor | PCB Module Type |
PCB SIZE | 40mm x 12mm x 1.0T |
Camera Resolution(MAX) | 8MP(3264x2448) |
Image Sensor | 1/4, 200um, Pixel size:1.12um |
Video Max frame rate | MJPEG: 8MP 10fps@(3264 x 2448), 4:3 |
5MP 10fps @(2592 x 1944) | |
2MP 60fps @(1600 x 1200) / YUY2:5fps@(1600x1200) | |
MIC | Option |
I/O Interface | USB 2.0 |
Camera Interface(AP-Camera) | MIPI(CSI-2/4 lane) |
Lens spec | 4P, F2.2 |
MCNEX who leads change of future will take a big step to the world with continuous innovative technology.
The invisible core technology of MCNEX is unseen but to turn everyone's imagination into reality,
is always closed to our life every time and everywhere.
MULTIMEDIA CORE OF THE NEXT... MCNEX
We will review and respond to inquiries as quickly as possible.
Contact UsMCNEX TOWER. 13-39, Songdogwahak-ro 16beon-gil, Yeonsu-gu, Incheon, Republic of Korea
T. +82. 2. 2025. 3600 F. +82. 2. 2025. 3610
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