미래의 스마트한 라이프스타일을 구성하는 차세대 IT기기의 보이지 않는 핵심 영상 솔루션 기술로
독보적인 경쟁력을 유지해 나아가고 있습니다.
SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA
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SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA. TILT OIS CAMERA
WIDE ANGLE VT CAMERA 90°,120°,135°,145°,182° 8M FF ~ 32M FF
MACRO CAMERA 5M FF SINGLE CAM 13 ~ 64M AFDUAL CAMERA
SINGLE, DUAL, TRIPLE, QUADRUPLE CAMERA.OIS, FOLDED ZOOM, TOF CAMERA
ITEMS | UNIT | SPEC |
---|---|---|
Rated Stroke | um | Min 2410 |
Hysteresis | um | Max 12 |
Linearity | um | Max 20 |
Holding Current | mA | Max 40 |
Actuating Tilt | Min | Max 10 |
ITEMS | UNIT | SPEC |
---|---|---|
Rated Stroke | Deg | Min 2.4 (±1.2) |
Hysteresis | Deg | Max 0.10 |
Linearity | Deg | Max 0.11 |
Max current | mA | Max 100 |
Phase margin | Deg | Max 25 |
Loop Gain | dB | Min 20 |
ITEMS | MIN | NORMAL | MAX | UNIT | REMARK |
---|---|---|---|---|---|
PKG Height | 222 | 270 | 318 | UM | |
Ball Pitch X | - | 500 | - | UM | |
Ball Pitch Y | - | 500 | - | UM | |
Total Ball Count | - | 314 | - | EA | |
Resolution | - | 320 X 240 | - | PX | QVGA |
Modulation frequency of VCSEL Driver | 20 | - | 100 | MHZ | |
VCSEL wavelength | - | 940 | - | NM |
Size | Removal of PCB, substrate-less | |
3D stacking of TOF sensor and the driver IC | ||
Thickness reduction (>230um) / Area reduction (>20%) | ||
Easy mounting | No Ceramic Carrier or substrate PCB needed | |
UseACF film or SMT process to electrically assemble the FOWLP onto the F-PCB | ||
Mass-production | The optical FOWLP is fabricated by the wafer level process with mass-production capability |
외형도 및 특징 |
MODULE TILT 방식을 적용, 기존 LENS SHIFT/TILT 방식의 문제점, 해상력 열화 없음 |
기존 사용화 방식 대비, 보정각도 2배 증가 (1.5DEG → ±3DEG) |
기존 사용화 제품 | 손 떨림 보정 기능 | MODULE TILT OIS | 손 떨림 보정 + 외부 흔들림(골곡지형 이동촬영 등) 보정 가능 |
ITEMS | CONDITION |
---|---|
Foot Print | A : 18.4 x 18.4 x 1.8H / B : 14.0 x 14.0 x 4.7H |
Stabilizing Angle | ± 3deg |
Max Current | AF : 50mA / OIS : 100mA (TBD) |
Pixels | 48M |
SENSOR | SONY 1/2" 48Mega CMOS IMS586-AAJH5-S |
Sensor Size | 4.504mm(H) x 5.659mm(V) |
LENS | SUNNY 39256 |
LENS Spec | 8.25/6P |
AF STROKE | 380 ~ 430um |
ITEM | USB Camera SPEC |
---|---|
Form factor | PCB Module Type |
PCB SIZE | 50mm x 7mm x 0.8T |
Camera Resolution(MAX) | 5MP(2592x1944) |
Image Sensor | 1/5, Pixel size:1.12um |
Video Max frame rate | 30fps@5Mp(2592 x 1944)/30fps@quad HD(2560 x 1440) |
MIC | 2MIC Support |
I/O Interface | USB 2.0 |
Camera Interface(AP-Camera) | MIPI(CSI-2/4 lane) |
Lens spec | 4P, F2.4 |
ITEM | USB Camera SPEC |
---|---|
Form factor | PCB Module Type |
PCB SIZE | 40mm x 12mm x 1.0T |
Camera Resolution(MAX) | 8MP(3264x2448) |
Image Sensor | 1/4, 200um, Pixel size:1.12um |
Video Max frame rate | MJPEG: 8MP 10fps@(3264 x 2448), 4:3 |
5MP 10fps @(2592 x 1944) | |
2MP 60fps @(1600 x 1200) / YUY2:5fps@(1600x1200) | |
MIC | Option |
I/O Interface | USB 2.0 |
Camera Interface(AP-Camera) | MIPI(CSI-2/4 lane) |
Lens spec | 4P, F2.2 |
끊임없는 기술 개발을 통한 혁신과 도전으로 더 넓은 세상을 향해 나아가겠습니다.
The invisible core technology of MCNEX is unseen but to turn everyone's imagination into reality,
is always closed to our life every time and everywhere.
MULTIMEDIA CORE OF THE NEXT... MCNEX
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